Low-Temperature Co-Fired Ceramic (LTCC) Technology

Txheej txheem cej luam

LTCC (Low-Temperature Co-Fired Ceramic) yog ib qho kev sib koom ua ke zoo tshaj plaws uas tau tshwm sim hauv xyoo 1982 thiab tau dhau los ua qhov kev daws teeb meem tseem ceeb rau kev sib koom ua ke. Nws tsav innovation nyob rau hauv lub passive tivthaiv sector thiab sawv cev rau ib tug tseem ceeb kev loj hlob cheeb tsam nyob rau hauv electronics kev lag luam

Kev tsim khoom

1. Kev npaj khoom:Ceramic hmoov, iav hmoov, thiab organic binders yog tov, cam khwb cia rau ntsuab tapes ntawm daim kab xev casting, thiab qhuav23.
2.Patterning:Cov duab hluav taws xob hauv Circuit Court yog tshuaj ntsuam-luam tawm rau cov kab xev ntsuab siv cov nyiaj siv hluav taws xob. Pre-printing laser drilling tej zaum yuav ua tau los tsim interlayer vias ntim nrog conductive paste23.
3. Lamination thiab Sintering:Cov txheej txheem ntau yam yog ua raws, sib dhos, thiab thermally compressed. Lub rooj sib txoos yog sintered ntawm 850-900 ° C los tsim ib lub monolithic 3D qauv12.
4.Post-Processing:Exposed electrodes tej zaum yuav raug tin-lead alloy plating rau solderability3.

Kev sib piv nrog HTCC

HTCC (High-Temperature Co-Fired Ceramic), lub tshuab ua ntej, tsis muaj iav additives nyob rau hauv nws cov ceramic txheej, yuav tsum tau sintering ntawm 1300-1600 ° C. Qhov no txwv cov khoom siv hluav taws xob rau cov hlau uas muaj melting point xws li tungsten lossis molybdenum, uas ua rau muaj kev ua haujlwm tsis zoo piv rau LTCC cov nyiaj lossis kub 34.

Qhov Zoo Tshaj Plaws

1.High-Frequency Performance:Tsawg dielectric tsis tu ncua (ε _r = 5-10) cov ntaub ntawv ua ke nrog cov khoom siv hluav taws xob siab ua kom muaj siab-Q, cov khoom siv ntau zaus (10 MHz-10 GHz +), suav nrog cov ntxaij lim dej, kav hlau txais xov, thiab lub zog faib hluav taws xob13.
2.Integration Peev Xwm:Ua kom yooj yim rau cov kab hluav taws xob ntau hauv cov khoom siv passive (piv txwv li, resistors, capacitors, inductors) thiab cov khoom siv nquag (xws li ICs, transistors) rau hauv cov qauv compact, txhawb System-in-Package (SiP) designs14.
3.Miniaturization:High-ε _r cov ntaub ntawv (ε _r > 60) txo hneev taw rau cov capacitors thiab cov lim dej, ua kom muaj cov qauv me me35.

Daim ntawv thov

1.Consumer Electronics:Dominates xov tooj ntawm tes (80% + kev ua lag luam qhia), Bluetooth modules, GPS, thiab WLAN li
2.Automotive thiab Aerospace:Kev txais yuav ntau ntxiv vim muaj kev ntseeg siab nyob rau hauv ib puag ncig hnyav
3.Advanced Module:Xws li LC lim, duplexers, baluns, thiab RF pem hauv ntej-kawg modules

Chengdu Concept Microwave Technology CO., Ltd yog cov chaw tsim khoom lag luam ntawm 5G / 6G RF Cheebtsam hauv Suav teb, suav nrog RF lowpass lim, highpass lim, bandpass lim, notch filter / band nres lim, duplexer, Fais fab divider thiab directional coupler. Tag nrho lawv tuaj yeem kho raws li koj qhov kev xav tau.
Txais tos rau peb lub vev xaib:www.concept-mw.comlos yog hu rau peb ntawm:sales@concept-mw.com