Txheej txheem cej luam
LTCC (Low-Temperature Co-Fired Ceramic) yog ib qho thev naus laus zis siab heev uas tau tshwm sim hauv xyoo 1982 thiab txij li ntawd los tau dhau los ua ib qho kev daws teeb meem rau kev sib koom ua ke. Nws tsav kev tsim kho tshiab hauv kev lag luam passive component thiab sawv cev rau thaj chaw loj hlob tseem ceeb hauv kev lag luam hluav taws xob.
Cov Txheej Txheem Tsim Khoom
1. Kev Npaj Khoom Siv:Cov hmoov av nplaum, hmoov iav, thiab cov organic binders raug sib xyaw, pov rau hauv cov kab xev ntsuab los ntawm kev pov cov kab xev, thiab ziab23.
2. Kev Tsim Qauv:Cov duab ntawm lub voj voog raug luam tawm rau ntawm cov kab xev ntsuab siv cov tshuaj nplaum nyiaj conductive. Kev siv laser drilling ua ntej luam tawm yuav raug ua los tsim cov vias interlayer uas muaj cov tshuaj nplaum conductive23.
3. Lamination thiab Sintering:Ntau txheej uas muaj qauv sib dhos ua ke, muab sib dhos ua ke, thiab nias kom nruj. Lub rooj sib dhos raug sintered ntawm 850–900°C los ua ib lub qauv 3D monolithic12.
4. Kev Ua Tom Qab:Cov electrodes uas raug tso tawm yuav raug plating nrog tin-lead alloy rau kev solderability3.
Kev sib piv nrog HTCC
HTCC (High-Temperature Co-Fired Ceramic), ib qho thev naus laus zis ua ntej, tsis muaj cov khoom siv iav ntxiv rau hauv nws cov txheej ceramic, uas yuav tsum tau sintering ntawm 1300–1600 ° C. Qhov no txwv cov khoom siv conductor rau cov hlau uas yaj sai xws li tungsten lossis molybdenum, uas qhia txog kev conductivity qis dua piv rau LTCC cov nyiaj lossis kub34.
Cov Txiaj Ntsig Tseem Ceeb
1. Kev Ua Haujlwm Zaus Siab:Cov khoom siv dielectric tsis tu ncua (ε r = 5–10) qis ua ke nrog cov nyiaj ua kom muaj peev xwm ua rau muaj cov khoom siv high-Q, high-frequency (10 MHz–10 GHz+), suav nrog cov lim dej, antennas, thiab cov khoom faib fais fab13.
2. Kev Muaj Peev Xwm Sib Koom Ua Ke:Pab txhawb rau ntau txheej circuits embedding passive Cheebtsam (piv txwv li, resistors, capacitors, inductors) thiab active devices (piv txwv li, ICs, transistors) rau hauv compact modules, txhawb System-in-Package (SiP) designs14.
3. Kev Ua Kom Me Me:Cov ntaub ntawv siab-ε r (ε r > 60) txo qhov chaw rau cov capacitors thiab cov lim dej, ua rau cov qauv me dua 35.
Cov ntawv thov
1. Cov Khoom Siv Hluav Taws Xob Rau Cov Neeg Siv Khoom:Tswj hwm cov xov tooj ntawm tes (80%+ feem ntawm kev ua lag luam), Bluetooth modules, GPS, thiab WLAN devices
2. Tsheb thiab Aerospace:Kev siv ntau ntxiv vim muaj kev ntseeg siab hauv cov chaw ib puag ncig hnyav
3. Cov Qauv Qib Siab:Xws li LC lim dej, duplexers, baluns, thiab RF front-end modules
Chengdu Concept Microwave Technology CO., Ltd yog ib lub tuam txhab tsim khoom ntawm 5G/6G RF Cheebtsam hauv Suav teb, suav nrog RF lowpass filter, highpass filter, bandpass filter, notch filter/band stop filter, duplexer, Power divider thiab directional coupler. Tag nrho lawv tuaj yeem hloov kho raws li koj cov kev xav tau.
Txais tos rau peb lub vev xaib:www.concept-mw.comlos yog hu rau peb ntawm:sales@concept-mw.com
Lub sijhawm tshaj tawm: Lub Peb Hlis-11-2025